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DOWSIL™ TC-6015 Thermal Conductive Encapsulant Kit Gray 10 KG | Official Distributor

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Technical Product Information

DOWSIL™ TC-6015 Thermal Conductive Encapsulant Kit Gray 10 KG

Product Overview

DOWSIL™ TC-6015 Thermal Conductive Encapsulant Gray is a 2-part (1:1 mix ratio), high thermal conductivity silicone potting and encapsulating compound formulated for effective thermal management and environmental protection in power electronics. Utilizing a platinum-catalyzed addition-cure system, it cures at room temperature or with heat acceleration with zero cure byproducts or volumetric shrinkage. Its reliable heat dissipation efficiency, balanced viscosity, and robust dielectric strength make it suitable for EV power modules, inverters, and industrial transformers. The 10 kg kit (5 kg Part A + 5 kg Part B) offers excellent convenience for medium-scale manufacturing and prototype dispensing.

Key Features and Benefits

• High Thermal Conductivity: Facilitates efficient heat transfer away from power electronic components to maintain optimal performance.
• 1:1 Convenient Mix Ratio: Simple 1:1 mix ratio by weight or volume integrates seamlessly into manual prep and automated meter-mix dispensing systems.
• Non-Corrosive Addition Cure: Releases no corrosive byproducts or solvents during cure, protecting sensitive circuit traces.
• Good Flowability: Flows smoothly into narrow voids and complex board geometries despite thermal filler loading.
• Broad Thermal Stability: Retains thermal conductivity, elasticity, and dielectric strength from -45°C to +180°C (-49°F to +356°F).
• Environmental Protection: Protects electronic assemblies against moisture, dust, vibration, and thermal shock.

Technical Specifications

• Color: Gray
• Packaging / Net Weight: Kit / 10 KG (5 KG Part A + 5 KG Part B)
• Mix Ratio (by weight / volume): 1:1
• Cure System: Addition-cure (Platinum catalyst)
• Thermal Conductivity: High Heat Dissipation Performance (~1.5 W/m.K level)
• Hardness (Shore A): ~50-60
• Service Temperature Range: -45°C to +180°C (-49°F to +356°F)

Applications

• Thermal potting and encapsulating of power supplies, adapters, transformers, inverters, and converters.
• Potting automotive electronics, EV power modules, and charging infrastructure systems.
• Thermally conductive encapsulation of high-power LED drivers, industrial control equipment, and motor drives.
• Industrial electronic assemblies requiring combined heat dissipation, electrical insulation, and moisture sealing.

Usage Note: Thoroughly mix Part A and Part B in a 1:1 ratio. Vacuum de-airing (degassing) prior to pouring is recommended to remove trapped air bubbles from the filled compound. Avoid contact with sulfur, amines, phosphorus, or organometallic compounds to prevent platinum catalyst cure inhibition. Fully compatible with manual processing and automated meter-mix dispensing systems.