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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant Kit Black 1 KG | Official Distributor

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Technical Product Information

DOWSIL™ EE-3200 Low Stress Silicone Encapsulant Kit Black 1 KG

Product Overview

DOWSIL™ EE-3200 Low Stress Silicone Encapsulant Black is a 2-part (1:1 mix ratio), low-viscosity, ultra-flexible silicone potting and encapsulating compound formulated to minimize thermal and mechanical stress on delicate electronic components. Utilizing a platinum-catalyzed addition-cure system, it cures at room temperature or with heat acceleration with zero cure byproducts or volumetric shrinkage. Its low durometer rubber/gel-like nature prevents solder joint fatigue and wire-bond damage during severe thermal cycling. The 1 kg kit (0.5 kg Part A + 0.5 kg Part B) is well-suited for laboratories, R&D prototyping, and low-volume electronic assembly.

Key Features and Benefits

• Low Stress Formulation: Ultra-flexible, low-durometer elastomer absorbs mechanical shocks and thermal expansion stresses.
• 1:1 Convenient Mix Ratio: Simple 1:1 mix ratio by weight or volume streamlines manual preparation and automated meter-mix dispensing.
• Thermal Cycling Resistance: Protects delicate solder joints, wire bonds, and fragile ICs under harsh temperature fluctuations.
• Low Mixed Viscosity: Flows readily into complex circuit geometries and narrow gaps.
• Non-Corrosive Addition Cure: Releases no corrosive byproducts or solvents during cure, protecting sensitive circuitry.
• Convenient 1 KG Kit: Ideal size for small batches, prototype development, and precision manual dispensing.

Technical Specifications

• Color: Black
• Packaging / Net Weight: Kit / 1 KG (0.5 KG Part A + 0.5 KG Part B)
• Mix Ratio (by weight / volume): 1:1
• Cure System: Addition-cure (Platinum catalyst)
• Mixed Viscosity: ~1,500 - 2,500 mPa.s
• Hardness (Shore A): ~20-30 (Low durometer, highly flexible)
• Service Temperature Range: -45°C to +180°C (-49°F to +356°F)

Applications

• Low-stress potting and encapsulation of delicate sensors, microelectronic modules, and fragile components.
• Automotive electronics, engine control units (ECUs), and vehicle sensors subjected to severe thermal shock.
• Environmental protection of power supplies, inverters, and relay modules against moisture, vibration, and impact.
• Potting assemblies containing substrates with mismatched thermal expansion coefficients (metals, plastics, ceramics).

Usage Note: Thoroughly mix Part A and Part B in a 1:1 ratio. Vacuum de-airing (degassing) prior to pouring is recommended to remove trapped air bubbles. Avoid contact with sulfur, amines, phosphorus, or organometallic compounds to prevent platinum catalyst cure inhibition.