DOWSIL

DOWSIL™ TC-5888 Thermally Conductive Compound Grey 1 KG | Official Distributor

Request a Quote

Technical Product Information

DOWSIL™ TC-5888 Thermally Conductive Compound Grey 1 KG

Product Overview

DOWSIL™ TC-5888 Thermally Conductive Compound Grey is an ultra-high performance, non-curing silicone thermal compound heavily filled with thermally conductive metal oxides. Delivering an exceptional thermal conductivity of ~5.2 W/m.K, it is engineered to achieve ultra-low thermal resistance and minimal Bond Line Thickness (BLT) between high power-density microprocessors, GPUs, power semiconductors, and heat sinks. Its specialized filler structure resists pump-out, vertical slump, and oil bleed during intense thermal power cycling. The 1 kg can package provides an ideal size for screen/stencil printing operations, high-reliability electronic manufacturing, and laboratory R&D.

Key Features and Benefits

• Ultra-High Thermal Conductivity (~5.2 W/m.K): Maximizes heat transfer efficiency for high-wattage CPUs, GPUs, and power electronics.
• Ultra-Low Thermal Resistance: Superior surface wetting enables thin bond lines and minimal thermal impedance.
• Non-Curing & Re-workable: Will not dry out, harden, or crack over time, allowing easy cleaning and rework during servicing.
• High Pump-Out Resistance: Resists displacement and slump under severe thermal cycling and vertical mounting orientation.
• Convenient 1 KG Can Size: Optimized for stencil/screen printing and semi-automated dispensing lines.
• Stable Dielectric Performance: Delivers reliable electrical insulation alongside outstanding thermal management.

Technical Specifications

• Appearance / Color: Grey paste
• Packaging / Net Weight: Can / 1 KG
• Chemical Base: Highly Filled Thermally Conductive Silicone Compound (Non-curing)
• Thermal Conductivity: ~5.2 W/m.K
• Specific Gravity (@ 25°C): ~3.2 g/cm³
• Service Temperature Range: -45°C to +150°C (-49°F to +302°F)

Applications

• Thermal interface material (TIM-1 & TIM-2) for high-performance server CPUs, GPUs, AI accelerators, and chipsets.
• Automotive power electronics, EV traction inverters, DC-DC converters, and fast-charging modules.
• High-brightness LED arrays, telecom base station power amplifiers, and industrial power supplies.
• Demanding electronic assemblies requiring maximum heat conduction and minimal thermal resistance.

Usage Note: Ensure all mating surfaces are thoroughly cleaned and degreased before application. Being a non-curing paste, applying a very thin, uniform layer via stencil printing or spatula minimizes thermal resistance. Keep the container tightly sealed when not in use to maintain material consistency.