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DOWSIL™ CN-8760 Thermally Conductive Encapsulant Kit Gray 50 KG | Official Distributor

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Technical Product Information

DOWSIL™ CN-8760 Thermally Conductive Encapsulant Kit Gray 50 KG

Product Overview

DOWSIL™ CN-8760 Thermally Conductive Encapsulant Gray is a 2-part (1:1 mix ratio), thermally conductive silicone potting and encapsulating compound formulated for effective thermal management and environmental protection in power electronics. Utilizing a platinum-catalyzed addition-cure system, it cures at room temperature or can be heat-accelerated with zero cure byproducts or volumetric shrinkage. Its high thermal conductivity, robust dielectric insulation, and stress-relieving flexibility make it ideal for power supplies, inverters, and automotive modules. The 50 kg kit (25 kg Part A + 25 kg Part B) provides superior processing efficiency for automated industrial dispensing lines.

Key Features and Benefits

• High Thermal Conductivity: Facilitates efficient heat dissipation away from critical heat-generating electronic components.
• 1:1 Convenient Mix Ratio: Simple 1:1 mix ratio by weight or volume streamlines automated meter-mix dispensing.
• Non-Corrosive Addition Cure: Releases no corrosive byproducts or solvents during cure, protecting sensitive circuitry.
• Good Flowability: Flows smoothly into narrow voids and complex circuit geometries despite thermal filler loading.
• Broad Thermal Stability: Retains thermal conductivity, elasticity, and dielectric strength from -45°C to +180°C (-49°F to +356°F).
• Vibration and Shock Protection: Absorbs mechanical vibration, thermal shocks, and protects against moisture ingress.

Technical Specifications

• Color: Gray
• Packaging / Net Weight: Kit / 50 KG (25 KG Part A + 25 KG Part B)
• Mix Ratio (by weight / volume): 1:1
• Cure System: Addition-cure (Platinum catalyst)
• Thermal Conductivity: High Heat Dissipation Performance (~0.8 - 1.0 W/m.K)
• Hardness (Shore A): ~50-60
• Service Temperature Range: -45°C to +180°C (-49°F to +356°F)

Applications

• Thermal potting and encapsulating of power supplies, adapters, transformers, inverters, and converters.
• Potting automotive electronics, EV battery management modules, and motor drive units.
• Thermally conductive encapsulation of LED power drivers, power modules, and industrial control equipment.
• General electronic encapsulation requiring combined heat dissipation, electrical insulation, and environmental sealing.

Usage Note: Thoroughly mix Part A and Part B in a 1:1 ratio. Vacuum de-airing (degassing) prior to pouring is recommended to remove trapped air bubbles from the filled compound. Avoid contact with sulfur, amines, phosphorus, or organometallic compounds to prevent platinum catalyst cure inhibition. Fully compatible with automated meter-mix dispensing systems.