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DOWSIL™ SYLGARD™ 577 Primerless Silicone Adhesive Gray 0.5 KG | Official Distributor
Barcode : 1.YP.DC1.EY.KR.ST.BS.018
260.28 Euro + VAT
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Technical Product Information |  |
| DOWSIL™ SYLGARD™ 577 Primerless Silicone Adhesive Gray 0.5 KG |
| Product Overview |
| DOWSIL™ SYLGARD™ 577 Primerless Silicone Adhesive Gray is a 2-part (10:1 mix ratio), heat-curing, addition-cure silicone adhesive engineered for high-performance primerless bonding in demanding industrial and electronic assemblies. Upon heat exposure, it cures rapidly without releasing cure byproducts, delivering a non-corrosive, high-strength flexible bond line. Its gray color and robust mechanical properties ensure exceptional performance for component staking and enclosure sealing. The 0.5 kg kit packaging is ideal for laboratory work, prototyping, and precision dispensing applications. |
| Key Features and Benefits |
| • Superior Primerless Adhesion: Excellent adhesion to metals (aluminum, steel, copper), glass, ceramics, and rigid plastics without the need for surface primers. • Rapid Heat Cure: Fast curing at elevated temperatures (100°C - 150°C) to accelerate production throughput. • Addition Cure Chemistry: No cure byproducts and negligible volumetric shrinkage, making it non-corrosive to sensitive electronics. • High Mechanical & Physical Strength: Absorbs mechanical shock, vibration, and thermal cycling stresses. • Wide Thermal Stability: Retains full elasticity and dielectric insulation properties from -45°C to +200°C (-49°F to +392°F). |
| Technical Specifications |
| • Color: Gray • Packaging / Net Weight: Kit / 0.5 KG • Mix Ratio (by weight): 10:1 (Part A : Part B) • Cure System: Addition-cure / Heat-cure (Platinum catalyst) • Cure Schedule: ~15-30 mins @ 100°C / ~5-10 mins @ 150°C • Tensile Strength: ~5.5 MPa • Elongation at Break: 180% • Hardness (Shore A): ~60 • Service Temperature Range: -45°C to +200°C (-49°F to +392°F) |
| Applications |
| • Primerless structural bonding and sealing of automotive electronics, sensors, and power modules. • High-strength industrial electronic bonding requiring elevated temperature resistance. • Enclosure assembly for security cameras, outdoor LED lighting, and industrial controls. • Bonding metal-to-plastic and metal-to-glass joints subject to severe vibration and thermal shock. |
Usage Note: Thoroughly mix Part A and Part B in a 10:1 ratio by weight. Vacuum de-airing (degassing) prior to application is recommended to eliminate trapped air bubbles. Avoid contact with materials containing sulfur, amines, phosphorus, or organometallic compounds, as these can inhibit the platinum catalyst cure. Heat cure in an oven is required to achieve full adhesion and physical properties.
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