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Technical Product Information |  |
| DOWSIL™ 340 Heat Sink Compound White 249.4 KG (Drum) |
| Product Overview |
| DOWSIL™ 340 Heat Sink Compound White is a non-curing, thermally conductive silicone fluid compound heavily filled with heat-conductive metal oxides. Engineered to fill microscopic air voids between heat-generating electronic components and heat sinks, it optimizes thermal coupling and heat dissipation efficiency. It maintains its paste-like consistency, high thermal conductivity, and electrical insulation without drying out, hardening, or bleeding oil at elevated temperatures. The bulk 249.4 kg industrial drum supply is designed for high-volume automated manufacturing lines, industrial follower-plate dispensing pumps, and continuous high-throughput assembly. |
| Key Features and Benefits |
| • Industrial Bulk Drum Supply (249.4 KG): Designed for continuous automated dispensing systems in high-volume electronics manufacturing. • Non-Curing Formulation: Will not dry out, harden, or crack over time, ensuring easy reworkability and component maintenance. • High Thermal Coupling Efficiency: Minimizes thermal resistance between power devices and heat sinks to extend electronic component life. • High Thermal Stability: Resists slump, run, and oil separation under continuous thermal stress. • Dielectric Insulation: High dielectric strength prevents short circuits across sensitive electronic substrates. • Wide Operating Temperature Range: Retains consistency and performance across extreme temperatures from -40°C to +200°C (-40°F to +392°F). |
| Technical Specifications |
| • Appearance / Color: White paste • Packaging / Net Weight: Industrial Drum / 249.4 KG • Chemical Base: Thermally Conductive Filled Silicone Compound (Non-curing) • Thermal Conductivity: ~0.67 W/m.K • Specific Gravity (@ 25°C): ~2.1 g/cm³ • Dielectric Strength: ~8.0 kV/mm • Service Temperature Range: -40°C to +200°C (-40°F to +392°F) |
| Applications |
| • Thermal coupling of transistors, diodes, power modules (IGBTs), and CPUs/GPUs to heat sinks. • Thermal management in automotive electronics, electronic control units (ECUs), and battery chargers. • Heat dissipation in LED lighting fixtures, power supplies, inverters, and rectifiers. • Automated high-volume production lines using follower-plate drum pumps and robotic dispensers. |
Usage Note: Ensure all mounting surfaces are clean, dry, and free of grease or debris prior to application. Applying a thin, uniform layer is sufficient to minimize thermal impedance. The 249.4 kg drum is fully compatible with industrial follower-plate drum pumping equipment and automated dispensing machinery.
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