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DOWSIL™ 3-4150 Dielectric Gel Kit Clear 36.2 KG | Official Distributor

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Technical Product Information

DOWSIL™ 3-4150 Dielectric Gel Kit Clear 36.2 KG

Product Overview

DOWSIL™ 3-4150 Dielectric Gel Clear is a 2-part (1:1 mix ratio), low-viscosity, fast room-temperature curing silicone dielectric gel engineered to encapsulate sensitive electronic modules, micro-wire bond structures, and automotive sensors. Utilizing a platinum-catalyzed addition-cure system, it cures cleanly without volumetric shrinkage or corrosive byproducts. Its rapid cure speed enhances throughput on high-volume production lines while providing excellent stress relief, moisture sealing, and electrical insulation. The bulk 36.2 kg kit (18.1 kg Part A + 18.1 kg Part B) is optimized for continuous automated meter-mix dispensing systems in high-volume manufacturing environments.

Key Features and Benefits

• Fast Room-Temperature Cure: Rapid cure profile at room temperature increases manufacturing throughput without requiring heating ovens.
• Industrial Bulk Kit (36.2 KG): Suited for continuous automated processing and automated meter-mix dispensing in high-volume production.
• 1:1 Convenient Mix Ratio: Equal 1:1 ratio by weight or volume simplifies automated equipment setup and processing.
• Low Thermal Cycling Stress: Soft gel matrix cushions delicate wire bonds and fragile solder connections against mechanical and thermal shock.
• High Optical Clarity: Transparent matrix allows post-encapsulation visual inspection of components and sub-assemblies.
• Robust Dielectric Insulation: Delivers superior electrical insulation and arc protection for sensitive electronic components.

Technical Specifications

• Appearance / Color: Clear / Transparent
• Packaging / Net Weight: Kit / 36.2 KG (18.1 KG Part A + 18.1 KG Part B)
• Mix Ratio (by weight / volume): 1:1
• Cure System: Addition-cure (Platinum catalyst)
• Mixed Viscosity: ~400-500 mPa.s (low viscosity, excellent flow)
• Cured Consistency: Soft Gel
• Service Temperature Range: -45°C to +150°C (-49°F to +302°F)

Applications

• High-volume encapsulation of automotive electronics, under-the-hood sensors, powertrain, and control units.
• Dielectric protection for sensitive power semiconductors, IGBT modules, and hybrid integrated circuits.
• Sealing terminal junction boxes, sensors, and electronic connectors exposed to moisture and mechanical vibration.
• Automated assembly processes requiring rapid cure times and low-stress encapsulation.

Usage Note: Thoroughly mix Part A and Part B in a 1:1 ratio. Vacuum de-airing (degassing) prior to pouring is recommended to remove trapped air bubbles. Avoid contact with sulfur, amines, phosphorus, or organometallic compounds to prevent platinum catalyst cure inhibition. Fully compatible with automated meter-mix processing equipment.