DOWSIL 340 is a silicone-based, electrically insulating, non-curing thermal compound designed to improve heat transfer between heat sources and heat sinks. With stability from -40°C to +200°C, low evaporation, and long-term performance, it is ideal for CPUs, GPUs, LEDs, power modules, and electronics.
DOWSIL™ 340 Heat Sink Compound is a silicone-based, non-curing, electrically insulating thermal compound developed to optimize heat transfer in electronic devices.
By filling microscopic air gaps between heat sources and heat sinks, it improves thermal conductivity, ensuring electronic systems operate within safe temperature ranges.
The compound extends the lifetime and performance of heat-sensitive components such as transistors, diodes, ICs, LEDs, power supplies, and electronic modules.
With its non-curing formulation, it maintains physical stability after application. It operates reliably between -40°C and +200°C, with low volatility and minimal migration, ensuring long-lasting heat management. Safe for direct contact with electronics, it prevents short circuits.
Key Features:
High thermal conductivity
Silicone-based & electrically insulating
Non-curing – ready to use
Low evaporation & low migration
Stable from -40°C to +200°C
Compatible with metals, ceramics, plastics
Long-lasting, stable performance
Applications:
Heat transfer between CPUs, GPUs, and heat sinks
LED lighting modules
Power electronics and inverter modules
Thermal management of sensitive electronic devices
Assembly of components requiring efficient heat dissipation
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