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DOWSIL™ TC-6040 Thermally Conductive Encapsulant Kit Gray 50 KG | Official Distributor

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Technical Product Information

DOWSIL™ TC-6040 Thermally Conductive Encapsulant Kit Gray 50 KG

Product Overview

DOWSIL™ TC-6040 Thermally Conductive Encapsulant Gray is a 2-part (1:1 mix ratio), ultra-high thermal conductivity silicone potting and encapsulating compound engineered to prevent excessive heat buildup in high-power electronic systems and automotive power modules. Utilizing a platinum-catalyzed addition-cure system, it cures at room temperature or with heat acceleration with zero cure byproducts or volumetric shrinkage. Its superior heat dissipation efficiency and excellent dielectric strength maximize component reliability and lifespan. The bulk 50 kg kit (25 kg Part A + 25 kg Part B) offers exceptional processing convenience and efficiency for high-volume automated meter-mix dispensing lines.

Key Features and Benefits

• Ultra-High Thermal Conductivity: Facilitates rapid heat transfer away from high-power electronic components to preserve system efficiency.
• Industrial Bulk Packaging (50 KG): Optimized for continuous high-volume automated potting lines and manufacturing efficiency.
• 1:1 Convenient Mix Ratio: Simple 1:1 mix ratio by weight or volume integrates seamlessly into automated meter-mix dispensing systems.
• Non-Corrosive Addition Cure: Releases no corrosive byproducts or solvents during cure, protecting sensitive circuit traces.
• Optimized Flowability: Designed to flow smoothly into complex board geometries and narrow gaps despite heavy thermal filler loading.
• Broad Thermal Stability: Retains thermal conductivity, elasticity, and dielectric strength from -45°C to +180°C (-49°F to +356°F).
• Robust Protection: Shields sensitive electronic assemblies against moisture, dust, vibration, and thermal shock.

Technical Specifications

• Color: Gray
• Packaging / Net Weight: Kit / 50 KG (25 KG Part A + 25 KG Part B)
• Mix Ratio (by weight / volume): 1:1
• Cure System: Addition-cure (Platinum catalyst)
• Thermal Conductivity: Ultra-High Heat Dissipation Performance (~3.5-4.0 W/m.K level)
• Hardness (Shore A): ~60-70
• Service Temperature Range: -45°C to +180°C (-49°F to +356°F)

Applications

• Automated thermal potting of electric vehicle (EV) power modules, battery management systems (BMS), inverters, and onboard chargers (OBC).
• High-volume encapsulation of high-density power supplies, transformers, industrial drives, and power converters.
• Thermal sealing for high-power LED drivers and telecommunications power units.
• Advanced electronic assemblies requiring maximum heat dissipation, electrical insulation, and mechanical shock absorption.

Usage Note: Thoroughly mix Part A and Part B in a 1:1 ratio. Vacuum de-airing (degassing) prior to pouring is recommended to remove trapped air bubbles from the heavily filled compound. Avoid contact with sulfur, amines, phosphorus, or organometallic compounds to prevent platinum catalyst cure inhibition. Fully compatible with automated meter-mix dispensing systems.