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DOWSIL™ TC-2035 CV Thermally Conductive Adhesive Kit Blue 50 KG | Official Distributor

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Technical Product Information

DOWSIL™ TC-2035 CV Thermally Conductive Adhesive Kit Blue 50 KG (Pail)

Product Overview

DOWSIL™ TC-2035 CV Thermally Conductive Adhesive Blue is a 2-part (1:1 mix ratio), 3.3 W/m.K high thermal conductivity silicone adhesive engineered for bonding heat-generating electronic components to heat sinks. Featuring Controlled Volatility (CV) technology, it minimizes low-molecular-weight siloxane volatile species to protect sensitive optics and electrical contacts against fogging and outgassing contamination. Curing cleanly at room temperature or rapidly with heat acceleration via a platinum addition-cure mechanism, it delivers strong, unprimed adhesion to metals, ceramics, and plastics. The bulk 50 kg pail kit (25 kg Part A + 25 kg Part B) is designed for continuous automated dispensing machinery, follower-plate pumps, and high-volume electronics assembly lines.

Key Features and Benefits

• Industrial Bulk Pail Supply (50 KG): Engineered for continuous automated dispensing equipment in high-volume manufacturing environments.
• High Thermal Conductivity (3.3 W/m.K): Delivers efficient heat dissipation from power devices to heat dissipating structures.
• Controlled Volatility (CV): Low volatile siloxane formulation protects sensitive optics and electrical relays against condensation.
• Primerless Structural Adhesion: Forms a durable, high-strength bond to metals, ceramics, glass, and engineering plastics without primers.
• 1:1 Mix Ratio Convenience: Equal 1:1 mix ratio by weight or volume simplifies automated meter-mix dispensing setup.
• Slump-Resistant Rheology: Holds its shape upon dispensing, resisting sag or movement on vertical surfaces prior to cure.
• Broad Thermal Stability: Maintains physical and thermal integrity across operating temperatures from -45°C to +150°C (-49°F to +302°F).

Technical Specifications

• Appearance / Color: Blue
• Packaging / Net Weight: Pail Kit / 50 KG (25 KG Part A + 25 KG Part B)
• Chemical Base: 2-Part Thermally Conductive Silicone Adhesive (Addition-cure / Platinum catalyst)
• Mix Ratio (by weight / volume): 1:1
• Thermal Conductivity: ~3.3 W/m.K
• Density (Cured): ~3.0 g/cm³
• Service Temperature Range: -45°C to +150°C (-49°F to +302°F)

Applications

• Automated thermal bonding in automotive electronics, ADAS camera/sensor modules, electronic control units (ECUs), and battery management systems (BMS).
• Thermal bonding for sensitive optics, LiDAR, and radar assemblies sensitive to siloxane outgassing.
• Component staking and thermal management in power electronics, inverters, and LED lighting drivers.
• High-volume electronic assembly lines requiring structural adhesion combined with high thermal conductivity.

Usage Note: Thoroughly mix Part A and Part B in a 1:1 ratio using automated meter-mix dispensing equipment fitted with static mixers. Avoid contact with sulfur, amines, or organometallic compounds to prevent platinum catalyst cure inhibition. Fully compatible with industrial follower-plate pail pumping equipment.