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DOWSIL™ TC-2022 Thermally Conductive Compound Grey 1.5 KG | Official Distributor

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Technical Product Information

DOWSIL™ TC-2022 Thermally Conductive Compound Grey 1.5 KG

Product Overview

DOWSIL™ TC-2022 Thermally Conductive Compound Grey is a high-performance, non-curing silicone thermal compound heavily filled with thermally conductive metal oxides. Delivering a high thermal conductivity of ~4.0 W/m.K, it is formulated to fill microscopic air voids between high power-density microprocessors, power components, and heat sinks to minimize thermal impedance. Advanced filler architecture prevents slump, vertical bleed, and pump-out during continuous power cycling. It maintains its soft paste consistency and high heat transfer capability without drying out or hardening over time. The 1.5 kg can package provides an ideal size for screen/stencil printing operations, high-reliability electronic assembly, and lab R&D.

Key Features and Benefits

• High Thermal Conductivity (~4.0 W/m.K): Delivers superior heat transfer efficiency for high power-density CPUs, GPUs, and power electronics.
• Low Thermal Impedance: Effectively wets surface micro-roughness to minimize contact thermal resistance and bond line thickness.
• Non-Curing Formulation: Will not dry out, crack, or harden, ensuring easy cleanability and reworkability during maintenance.
• Pump-Out & Slump Resistance: Resists migration and displacement under severe thermal cycling and vertical mounting conditions.
• Convenient 1.5 KG Can Package: Suited for stencil/screen printing processes and semi-automated dispensing lines.
• Reliable Thermal Stability: Maintains performance integrity across severe operating temperature extremes.

Technical Specifications

• Appearance / Color: Grey paste
• Packaging / Net Weight: Can / 1.5 KG
• Chemical Base: Thermally Conductive Filled Silicone Compound (Non-curing)
• Thermal Conductivity: ~4.0 W/m.K
• Specific Gravity (@ 25°C): ~2.7 g/cm³
• Service Temperature Range: -45°C to +150°C (-49°F to +302°F)

Applications

• Thermal interface material (TIM) for high-performance CPUs, GPUs, chipsets, and memory modules.
• Automotive power electronics, inverters, DC-DC converters, and battery management systems (BMS).
• High-brightness LED fixtures, power supplies, telecommunications base stations, and server racks.
• Electronic assemblies requiring high thermal conductivity and a non-curing grease interface.

Usage Note: Ensure all mating surfaces are clean, dry, and free of oil or contaminants before application. Applying a thin, uniform layer via stencil printing or spatula is sufficient to minimize thermal resistance. Keep container tightly sealed when not in use.