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DOWSIL™ TC-2022 Thermally Conductive Compound Grey 10 KG | Official Distributor

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Technical Product Information

DOWSIL™ TC-2022 Thermally Conductive Compound Grey 10 KG (Pail)

Product Overview

DOWSIL™ TC-2022 Thermally Conductive Compound Grey is a high-performance, non-curing silicone thermal compound heavily filled with thermally conductive metal oxides. Delivering a high thermal conductivity of ~4.0 W/m.K, it is formulated to fill microscopic air voids between high power-density microprocessors, power components, and heat sinks to minimize thermal impedance. Advanced filler architecture prevents slump, vertical bleed, and pump-out during continuous power cycling. It maintains its soft paste consistency and high heat transfer capability without drying out or hardening over time. The bulk 10 kg pail supply is optimized for continuous automated dispensing machinery, follower-plate pumps, and high-volume electronics assembly lines.

Key Features and Benefits

• Industrial Bulk Pail Supply (10 KG): Engineered for continuous automated dispensing equipment in high-volume manufacturing environments.
• High Thermal Conductivity (~4.0 W/m.K): Delivers superior heat transfer efficiency for high power-density CPUs, GPUs, and power electronics.
• Low Thermal Impedance: Effectively wets surface micro-roughness to minimize contact thermal resistance and bond line thickness.
• Non-Curing Formulation: Will not dry out, crack, or harden, ensuring easy cleanability and reworkability during maintenance.
• Pump-Out & Slump Resistance: Resists migration and displacement under severe thermal cycling and vertical mounting conditions.
• Reliable Thermal Stability: Maintains performance integrity across severe operating temperature extremes.

Technical Specifications

• Appearance / Color: Grey paste
• Packaging / Net Weight: Pail / 10 KG
• Chemical Base: Thermally Conductive Filled Silicone Compound (Non-curing)
• Thermal Conductivity: ~4.0 W/m.K
• Specific Gravity (@ 25°C): ~2.7 g/cm³
• Service Temperature Range: -45°C to +150°C (-49°F to +302°F)

Applications

• Automated thermal interface material (TIM) application for CPUs, GPUs, chipsets, and memory modules.
• Automotive power electronics, inverters, DC-DC converters, and battery management systems (BMS).
• High-brightness LED fixtures, power supplies, telecommunications base stations, and server racks.
• High-volume electronic assemblies requiring high thermal conductivity and a non-curing grease interface.

Usage Note: Ensure all mating surfaces are clean, dry, and free of oil or contaminants before application. Applying a thin, uniform layer via stencil printing or automated dispensing minimizes thermal resistance. The 10 kg pail is fully compatible with industrial follower-plate pail pumping systems.