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DOWSIL™ SE 4485 Thermally Conductive Adhesive White 330 ML | Official Distributor

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Technical Product Information

DOWSIL™ SE 4485 Thermally Conductive Adhesive White 330 ML

Product Overview

DOWSIL™ SE 4485 Thermally Conductive Adhesive White is a one-part, fast room-temperature moisture-curing (RTV), thermally conductive silicone adhesive engineered for bonding heat-generating electronic components to heat sinks. Its non-corrosive alkoxy cure mechanism produces no harmful byproducts, making it fully safe for delicate copper circuitry. Featuring a non-slump thixotropic paste consistency, it holds its shape during vertical dispensing and forms a strong, unprimed bond to aluminum, copper, FR4, and engineering plastics. The 330 ml cartridge package provides convenience for manual caulking guns and automated dispensing equipment.

Key Features and Benefits

• High Thermal Conductivity (~1.5 W/m.K): Efficiently conducts heat away from power devices to heat sinks, improving component reliability.
• Fast One-Part RTV Cure: Ready-to-use formulation rapidly skins over and cures upon exposure to atmospheric moisture, accelerating cycle times.
• Non-Corrosive Alkoxy Cure: Safe for copper traces and sensitive electronics with no corrosive byproduct release during cure.
• Primerless Structural Adhesion: Forms a high-strength bond to metals, ceramics, glass, and engineering plastics without requiring primers.
• Non-Slump Thixotropic Paste: Resists sag and run on vertical or overhead bonding applications prior to cure.
• Broad Thermal Stability: Maintains flexibility and bond strength across extreme operating temperatures from -45°C to +180°C (-49°F to +356°F).

Technical Specifications

• Appearance / Color: White
• Packaging / Volume: Cartridge / 330 ML
• Chemical Base: One-Part Thermally Conductive Silicone (RTV Alkoxy Cure)
• Cure System: Fast Room Temperature Moisture Cure (RTV)
• Thermal Conductivity: ~1.5 W/m.K
• Specific Gravity (@ 25°C): ~2.4 g/cm³
• Service Temperature Range: -45°C to +180°C (-49°F to +356°F)

Applications

• Thermal bonding and mechanical fixing of transistors, diodes, IGBT power modules, and power resistors to heat sinks.
• Environmental and thermal sealing of automotive electronics, engine control units (ECUs), and sensor housings.
• Component staking, thermal management, and vibration damping in LED lighting, power supplies, and inverters.
• Electronic assembly applications requiring fast RTV curing combined with high thermal conductivity.

Usage Note: Ensure all bonding surfaces are clean, dry, and free of oil or contaminants before application. As a moisture-curing material, cure depth depends on ambient humidity and time; thin-section bonding is recommended for optimal cure rate. Compatible with standard 330 ml caulking guns and automated dispensing systems.