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DOWSIL™ EI-2888 Primerless Silicone Encapsulant Kit Clear 38 KG | Official Distributor

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Technical Product Information

DOWSIL™ EI-2888 Primerless Silicone Encapsulant Kit Clear 38 KG

Product Overview

DOWSIL™ EI-2888 Primerless Silicone Encapsulant Clear is a 2-part (1:1 mix ratio), low-viscosity optical grade silicone encapsulation and potting compound formulated for high light transmission and primerless adhesion to LED luminaires and sensitive electronics. Curing at room temperature via an addition-cure platinum catalyst system, it cures with zero cure byproducts or volumetric shrinkage. Its outstanding water resistance, UV stability, and crystal clarity ensure long-term protection for outdoor luminaires and harsh environment electronics. The 38 kg bulk kit (19 kg Part A + 19 kg Part B) offers excellent productivity for high-volume automated meter-mix processing lines.

Key Features and Benefits

• High Optical Clarity: Outstanding light transmission and UV resistance ensuring non-yellowing, crystal-clear performance.
• Room Temperature Primerless Adhesion: Excellent unprimed bonding to glass, aluminum, polycarbonate, and PCB substrates without heat or surface primers.
• 1:1 Convenient Mix Ratio: Simple 1:1 mix ratio by weight or volume streamlines automated meter-mix dispensing.
• Room Temperature Cure: Ideal for heat-sensitive components, with optional heat acceleration for faster line speeds.
• Moisture & Weathering Protection: Provides robust ingress protection against water, humidity, and environmental contaminants.
• Good Flowability: Low mixed viscosity flows smoothly around intricate LED arrays and narrow electronic housings.

Technical Specifications

• Color: Clear / Transparent
• Packaging / Net Weight: Kit / 38 KG (19 KG Part A + 19 KG Part B)
• Mix Ratio (by weight / volume): 1:1
• Cure System: Addition-cure (Platinum catalyst)
• Mixed Viscosity: ~3,000 mPa.s
• Hardness (Shore A): ~30-40
• Service Temperature Range: -45°C to +150°C (-49°F to +302°F)

Applications

• Transparent potting and environmental sealing of outdoor LED lighting, architectural fixtures, and streetlights.
• Encapsulation of flexible and rigid LED strips, optical lenses, and sensor modules.
• Potting marine electronics, underwater lighting, and splash-proof electrical enclosures.
• Precision electronic assembly requiring optical transparency, room-temperature curing, and primerless adhesion.

Usage Note: Thoroughly mix Part A and Part B in a 1:1 ratio. Vacuum de-airing (degassing) prior to pouring is recommended to ensure bubble-free optical clarity. Avoid contact with sulfur, amines, phosphorus, or organometallic compounds to prevent platinum catalyst cure inhibition. Fully compatible with automated meter-mix dispensing equipment.