✓Free Shipping on 10+ Items✓Ships from Stock✓Official Distributor in Turkey✓Original Product Guarantee✓Same-Day Shipping
EN − TL
Türkçe
Account
Cart
DOWSIL TC-4525 Thermally Conductive Gap Filler | 50ml
Barcode : 1.YP.DC1.EY.BL.SÇ.KT.011
Product Code : 1.YP.DC1.EY.BL.SÇ.KT.011
325.00 Euro + VAT
 |
Technical Product Data |  |
| DOWSIL™ TC-4525 Thermally Conductive Gap Filler – Two-Part Thermal Interface Material |
| Product Description |
| DOWSIL™ TC-4525 (Part A & B) is a two-component, 1:1 mix ratio silicone-based thermally conductive gap filler featuring a high thermal conductivity of 2.5 W/m·K. Engineered to dissipate heat from electronic components mounted on printed circuit boards to heat sinks, it cures to a soft, compliant elastomer to minimize mechanical stress. |
| Key Features |
| • Thermal Conductivity: 2.5 W/m·K • Mix Ratio: 1:1 (By weight and volume) • Hardness (Cured): ~40 Shore 00 (Soft, compressible gel structure) • Dielectric Strength: ~12 kV/mm • Density (Cured): 2.9 g/cm³ • Rheology: Thixotropic (Holds vertical position in cured or uncured state) • Flame Rating: UL 94 V-0 recognized • Operating Temperature Range: -45°C to +150°C (Peak exposure at 200°C) |
| Applications |
| • Automotive electronics (Engine Control Units, Transmission Control Units - ECU/TCU) • Advanced Driver Assistance Systems (ADAS) and radar/sensor modules • Electric Vehicle (EV) battery assemblies and power conversion modules • Thermal gap filling between PCB components and aluminum enclosures • Automated meter-mix dispensing equipment for high-volume manufacturing |
| Key Advantages |
| • Optimized rheology for smooth assembly process line integration with automated dispensing • Flexible cure options: room temperature cure or fast heat-accelerated cure (10 mins @ 80°C) • Non-slump performance maintains stability on vertical surfaces during processing • Low compression stress relieves strain on delicate microelectronic components |
Application Note: For optimal performance, mix Parts A and B at a 1:1 ratio using a static mixer. Ensure substrate surfaces are thoroughly cleaned and dry prior to dispensing.
Related & Recommended Products
