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DOWSIL TC-5515 LT Thermally Conductive Gap Filler 400 ML
Barcode : 1.YP.DC1.EY.BL.SÇ.KT.012
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Technical Product Data |  |
| DOWSIL™ TC-5515 LT Thermally Conductive Gap Filler (400 ml) – Two-Part Low Density Silicone Material |
| Product Description |
| DOWSIL™ TC-5515 LT is a two-component, 1:1 mix ratio silicone-based thermally conductive gap filler featuring a low density of 1.95 g/cm³ and a thermal conductivity of 2.0 W/m·K. Formulated for EV battery modules and control unit assemblies, it cures to a soft, compliant elastomer to dissipate heat and relieve mechanical stress. |
| Key Features |
| • Thermal Conductivity: 2.0 W/m·K • Low Density: 1.95 g/cm³ (Supports weight reduction) • Mix Ratio: 1:1 (Parts A & B) • Hardness (Cured): ~65 Shore 00 (Soft, compressible, and stress-relieving) • Electrical Insulation: Dielectric Strength 19.0 kV/mm • Rheology: Thixotropic (Non-slumping on vertical surfaces) • Flame Rating: UL 94 V-0 recognized • Operating Temperature Range: -40°C to +150°C |
| Applications |
| • Electric Vehicle (EV) battery modules and cell-to-chassis thermal interfaces • Power control units (ECU), inverters, and automotive power electronics • Thermal gap filling between PCB-mounted components and aluminum heatsinks • Manual dispensing guns or automated dispensing lines |
| Key Advantages |
| • Convenient 400 ml dual-cartridge format ideal for precise application and maintenance • Low specific gravity reduces overall module weight in automotive applications • Room-temperature cure or accelerated heat cure (30 mins @ 80°C) • Tacky surface after cure facilitates easy rework and disassembly if needed |
Application Note: For optimal performance, mix Parts A and B at a 1:1 ratio using a static mixer. Ensure substrate surfaces are thoroughly cleaned and dry prior to dispensing.
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