DOWSIL

DOWSIL™ 93-500 Space Grade Encapsulant Low Outgassing Clear Silicone Potting Kit (110 g) - Türkiye's Official Distributor

Barcode : 1.YP.DC1.EY.KR.ST.BS.003

Product Code : 1.YP.DC1.EY.KR.ST.BS.003

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Technical Product Data

DOWSIL™ 93-500 Space Grade Encapsulant Kit (110 g) – Low Outgassing Two-Part Silicone Encapsulant

Product Description

DOWSIL™ 93-500 Space Grade Encapsulant Kit (100g Part A + 10g Part B catalyst) is a two-component, clear, low-outgassing silicone potting and encapsulating compound specifically engineered for spacecraft, satellites, and high-altitude aerospace hardware. It meets the strict outgassing requirements of NASA space standards.

Key Features

• Space Grade Low Outgassing: Complies with NASA SP-R-0022A standards (CVCM <0.1%, TML <1%)
• Mix Ratio: 100 parts Part A to 10 parts Part B catalyst by weight
• Cure Mechanism: Heat-accelerated addition cure system
• Optical Transparency: High clarity allows visual inspection of circuit boards and solder joints after cure
• Flexibility & Shock Resistance: Soft elastomeric structure resists cracking under thermal cycling
• Service Temperature Range: Exceptional stability from -115°C up to +200°C

Applications

• Satellite sub-systems, spacecraft electronics, and optical instrument protection
• High-reliability electronic circuit modules and sensors in aerospace and defense
• Optoelectronic assemblies requiring zero condensation or contamination in high vacuum
• Laboratory R&D, prototype fabrication, and specialized aerospace projects

Key Advantages

• 110 g (100+10 g) convenient kit size ideal for R&D testing, prototyping, and small-scale critical potting
• Prevents volatile siloxanes from vaporizing in vacuum environments and clouding sensitive optical lenses or contacts
• Relieves mechanical stress across extreme cryogenic and high-temperature cycles to protect solder joints
• Provides superior dielectric insulation preventing arcing under high-voltage conditions

Application Note: Accurately weigh 100 parts of Part A and 10 parts of Part B catalyst. Mix thoroughly, degas under vacuum to eliminate trapped air bubbles, and apply heat (e.g., 65°C - 100°C) to cure.