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DOWSIL™ SYLGARD™ 567 Primerless Silicone Encapsulant Kit Black 2 KG | Official Distributor

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Technical Product Information

DOWSIL™ SYLGARD™ 567 Primerless Silicone Encapsulant Kit Black 2 KG

Product Overview

DOWSIL™ SYLGARD™ 567 Primerless Silicone Encapsulant Black is a 2-part (1:1 mix ratio), low-viscosity silicone encapsulation and potting compound engineered for robust primerless adhesion to diverse substrates. Utilizing a heat-accelerated addition-cure chemistry, it cures with zero cure byproducts or volumetric shrinkage. Certified with a UL 94 V-0 flame rating, it satisfies stringent electrical safety requirements while providing excellent dielectric insulation and vibration damping. The 2 kg kit (1 kg Part A + 1 kg Part B) is well-suited for prototyping, laboratory work, and medium-scale electronic assembly.

Key Features and Benefits

• Superior Primerless Adhesion: Exceptional adhesion to metals, glass, ceramics, and rigid engineering plastics without surface primers.
• 1:1 Convenient Mix Ratio: Simple 1:1 mix ratio by weight or volume streamlines manual prep and automated meter-mix dispensing.
• UL 94 V-0 Flame Retardancy: Recognized flame-retardant performance for safety-critical electrical and electronic modules.
• Non-Corrosive Addition Cure: Releases no corrosive byproducts or solvents during cure, protecting sensitive circuit traces.
• Good Flowability: Low mixed viscosity flows smoothly around complex circuit geometries and narrow gaps.
• Broad Thermal Stability: Retains full elasticity, dielectric strength, and shock absorption from -45°C to +200°C (-49°F to +392°F).

Technical Specifications

• Color: Black
• Packaging / Net Weight: Kit / 2 KG (1 KG Part A + 1 KG Part B)
• Mix Ratio (by weight / volume): 1:1
• Cure System: Addition-cure / Heat-cure (Platinum catalyst)
• Mixed Viscosity: ~2,500 mPa.s
• Hardness (Shore A): ~38-45
• Service Temperature Range: -45°C to +200°C (-49°F to +392°F)

Applications

• Primerless potting and encapsulating of power supplies, adapters, inverters, transformers, and electronic sensors.
• Environmental protection for automotive electronics, control units, connectors, and junction enclosures.
• Sealing LED drivers, outdoor lighting modules, and industrial control equipment.
• Electronic encapsulation requiring primerless adhesion, UL 94 V-0 flame rating, and robust dielectric insulation.

Usage Note: Thoroughly mix Part A and Part B in a 1:1 ratio. Vacuum de-airing (degassing) prior to pouring is recommended to eliminate trapped air bubbles. Heat curing in an oven (e.g., 100°C to 125°C) is required to achieve optimal primerless adhesion and cure speed. Avoid contact with sulfur, amines, or organometallic compounds to prevent platinum catalyst cure inhibition.