DOWSIL

DOWSIL™ SE 4420 RTV Thermally Conductive Adhesive White 330 ML | Official Distributor

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Technical Product Information

DOWSIL™ SE 4420 RTV Thermally Conductive Adhesive White 330 ML

Product Overview

DOWSIL™ SE 4420 RTV Thermally Conductive Adhesive White is a one-part, room-temperature moisture-curing (RTV), thermally conductive silicone adhesive engineered for bonding, fixing, and transferring heat from electronic components to heat sinks. Its non-corrosive alkoxy cure system releases no harmful byproducts, ensuring compatibility with sensitive copper traces and electronic circuitry. Featuring a non-slump thixotropic paste consistency, it holds its shape during vertical application and forms a strong, unprimed bond to various metals, glass, and engineering plastics. The 330 ml cartridge packaging provides ease of handling for standard caulking guns and automated dispensing equipment.

Key Features and Benefits

• High Thermal Conductivity: Enhances heat dissipation from power devices to heat dissipating structures, extending operational life.
• One-Part RTV Convenience: Ready-to-use formulation cures at room temperature upon exposure to atmospheric moisture without mixing.
• Non-Corrosive Alkoxy Cure: Produces no corrosive byproducts during cure, protecting sensitive circuit substrates.
• Primerless Adhesion: Forms a durable, high-strength bond to aluminum, copper, FR4, ceramics, and engineering plastics.
• Non-Slump Thixotropic Paste: Resists sag and run on vertical or overhead bonding surfaces prior to skinning.
• Broad Thermal Stability: Retains elasticity and adhesion performance across extreme temperatures from -45°C to +180°C (-49°F to +356°F).

Technical Specifications

• Appearance / Color: White
• Packaging / Volume: Cartridge / 330 ML
• Chemical Base: One-Part Thermally Conductive Silicone (RTV Alkoxy Cure)
• Cure System: Room Temperature Moisture Cure (RTV)
• Thermal Conductivity: ~0.92 W/m.K
• Specific Gravity (@ 25°C): ~2.2 g/cm³
• Service Temperature Range: -45°C to +180°C (-49°F to +356°F)

Applications

• Thermal bonding and mechanical fixing of transistors, diodes, IGBT power modules, and power resistors to heat sinks.
• Environmental and thermal sealing of automotive electronics, engine control units (ECUs), and sensor housings.
• Component staking, thermal management, and vibration damping in LED lighting, power supplies, and inverters.
• Electronic assembly applications requiring structural adhesion combined with thermal management.

Usage Note: Ensure all bonding surfaces are clean, dry, and free of oil or contaminants before application. As a moisture-curing material, cure depth is dependent on ambient humidity and time; thin-section bonding is recommended for optimal cure rate. Compatible with standard 330 ml caulking guns and automated dispensing systems.