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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant Kit Black 50 KG | Official Distributor

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Technical Product Information

DOWSIL™ EE-3200 Low Stress Silicone Encapsulant Kit Black 50 KG

Product Overview

DOWSIL™ EE-3200 Low Stress Silicone Encapsulant Black is a 2-part (1:1 mix ratio), low-viscosity, ultra-flexible silicone potting and encapsulating compound formulated to minimize thermal and mechanical stress on delicate electronic components. Utilizing a platinum-catalyzed addition-cure system, it cures at room temperature or with heat acceleration with zero cure byproducts or volumetric shrinkage. Its low durometer rubber/gel-like nature prevents solder joint fatigue and wire-bond damage during severe thermal cycling. The 50 kg bulk kit (25 kg Part A + 25 kg Part B) offers exceptional processing efficiency for high-volume automated meter-mix dispensing lines.

Key Features and Benefits

• Low Stress Formulation: Ultra-flexible, low-durometer elastomer absorbs mechanical shocks and thermal expansion stresses.
• 1:1 Convenient Mix Ratio: Simple 1:1 mix ratio by weight or volume streamlines automated meter-mix dispensing.
• Thermal Cycling Resistance: Protects delicate solder joints, wire bonds, and fragile ICs under harsh temperature fluctuations.
• Low Mixed Viscosity: Flows readily into complex circuit geometries and narrow gaps.
• Non-Corrosive Addition Cure: Releases no corrosive byproducts or solvents during cure, protecting sensitive circuitry.
• Bulk Industrial Kit (50 KG): Optimized for continuous automated processing in high-volume electronic manufacturing.

Technical Specifications

• Color: Black
• Packaging / Net Weight: Kit / 50 KG (25 KG Part A + 25 KG Part B)
• Mix Ratio (by weight / volume): 1:1
• Cure System: Addition-cure (Platinum catalyst)
• Mixed Viscosity: ~1,500 - 2,500 mPa.s
• Hardness (Shore A): ~20-30 (Low durometer, highly flexible)
• Service Temperature Range: -45°C to +180°C (-49°F to +356°F)

Applications

• Low-stress potting and encapsulation of delicate sensors, microelectronic modules, and fragile components.
• Automotive electronics, engine control units (ECUs), and vehicle sensors subjected to severe thermal shock.
• Environmental protection of power supplies, inverters, and relay modules against moisture, vibration, and impact.
• Potting assemblies containing substrates with mismatched thermal expansion coefficients (metals, plastics, ceramics).

Usage Note: Thoroughly mix Part A and Part B in a 1:1 ratio. Vacuum de-airing (degassing) prior to pouring is recommended to remove trapped air bubbles. Avoid contact with sulfur, amines, phosphorus, or organometallic compounds to prevent platinum catalyst cure inhibition. Fully compatible with automated meter-mix dispensing systems.