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| DOWSIL™ 96-083 Silicone Adhesive Kit Clear 3.9 KG |
| Product Overview |
| DOWSIL™ 96-083 Silicone Adhesive Kit Clear is a 2-part (10:1 mix ratio), addition-cure silicone adhesive engineered for optical transparency, flexible bonding, and high insulation in electronics and precision optics. Curing at room temperature or accelerated with heat, it forms a non-corrosive, non-yellowing, and flexible silicone joint with zero cure byproducts. Its high optical clarity makes it ideal for display modules, glass-to-metal bonding, and optical sensor assemblies. The 3.9 kg kit packaging provides an efficient supply for medium-to-large industrial manufacturing lines. |
| Key Features and Benefits |
| • High Optical Clarity: Non-yellowing, highly transparent flexible bond line. • Non-Corrosive Addition Cure: Releases no cure byproducts and exhibits negligible volumetric shrinkage, protecting sensitive electronic parts. • Versatile Cure Conditions: Cures at room temperature or rapidly under heat acceleration. • Unprimed Adhesion: Excellent adhesion to glass, metals, ceramics, and rigid plastics. • Thermal & Dielectric Performance: Maintains full elasticity and dielectric insulation properties over broad temperature ranges. |
| Technical Specifications |
| • Color: Clear / Transparent • Packaging / Net Weight: Kit / 3.9 KG • Mix Ratio (by weight): 10:1 (Part A : Part B) • Cure System: Addition-cure (Platinum catalyst) • Viscosity (Mixed): Medium / Low viscosity • Hardness (Shore A): ~30-40 • Service Temperature Range: -45°C to +180°C (-49°F to +356°F) |
| Applications |
| • Transparent flexible bonding of display panels, touch screens, and optical sensors. • Assembly of LED lighting modules, lens covers, and optical housings. • Component fixing and environmental protection in sensitive electronic assemblies. • Industrial bonding tasks requiring optical transparency, non-corrosive cure, and vibration damping. |
Usage Note: Thoroughly mix Part A and Part B in a 10:1 ratio by weight until homogeneous. Vacuum de-airing (degassing) prior to application is recommended to eliminate air bubbles. Avoid contact with sulfur, amines, or organometallic compounds to prevent cure inhibition.
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