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DOWSIL™ 96-083 Silicone Adhesive Kit Clear 3.9 KG | Official Distributor

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DOWSIL Logo Technical Product Information Teknik Expo Corporate Logo
DOWSIL™ 96-083 Silicone Adhesive Kit Clear 3.9 KG
Product Overview
DOWSIL™ 96-083 Silicone Adhesive Kit Clear is a 2-part (10:1 mix ratio), addition-cure silicone adhesive engineered for optical transparency, flexible bonding, and high insulation in electronics and precision optics. Curing at room temperature or accelerated with heat, it forms a non-corrosive, non-yellowing, and flexible silicone joint with zero cure byproducts. Its high optical clarity makes it ideal for display modules, glass-to-metal bonding, and optical sensor assemblies. The 3.9 kg kit packaging provides an efficient supply for medium-to-large industrial manufacturing lines.
Key Features and Benefits
• High Optical Clarity: Non-yellowing, highly transparent flexible bond line.
• Non-Corrosive Addition Cure: Releases no cure byproducts and exhibits negligible volumetric shrinkage, protecting sensitive electronic parts.
• Versatile Cure Conditions: Cures at room temperature or rapidly under heat acceleration.
• Unprimed Adhesion: Excellent adhesion to glass, metals, ceramics, and rigid plastics.
• Thermal & Dielectric Performance: Maintains full elasticity and dielectric insulation properties over broad temperature ranges.
Technical Specifications
• Color: Clear / Transparent
• Packaging / Net Weight: Kit / 3.9 KG
• Mix Ratio (by weight): 10:1 (Part A : Part B)
• Cure System: Addition-cure (Platinum catalyst)
• Viscosity (Mixed): Medium / Low viscosity
• Hardness (Shore A): ~30-40
• Service Temperature Range: -45°C to +180°C (-49°F to +356°F)
Applications
• Transparent flexible bonding of display panels, touch screens, and optical sensors.
• Assembly of LED lighting modules, lens covers, and optical housings.
• Component fixing and environmental protection in sensitive electronic assemblies.
• Industrial bonding tasks requiring optical transparency, non-corrosive cure, and vibration damping.
Usage Note: Thoroughly mix Part A and Part B in a 10:1 ratio by weight until homogeneous. Vacuum de-airing (degassing) prior to application is recommended to eliminate air bubbles. Avoid contact with sulfur, amines, or organometallic compounds to prevent cure inhibition.
Prepared by  T-Soft E-Commerce.