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DOWSIL

DOWSIL SE 4486 Thermally Conductive Silicone Adhesive 330 ML - Türkiye's Official Distributor

Barcode : 1.YP.DC1.EY.KR.ST.BS.017

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Technical Product Data

DOWSIL™ SE 4486 Thermally Conductive Adhesive (330 ml / 860 g) – One-Part Fast RTV Silicone Adhesive Cartridge

Product Description

DOWSIL™ SE 4486 is a one-part, room-temperature moisture-curing (RTV) alkoxy-neutral, non-slump thermally conductive silicone adhesive engineered to provide high thermal transfer and strong unprimed adhesion between electronic heat sources and heat sinks. Features fast tack-free time for high-throughput assembly.

Key Features

• Thermal Conductivity: ~1.5 W/m·K
• Cure Mechanism: One-part RTV neutral alkoxy moisture cure (no mixing required)
• Fast Tack-Free Time: Rapid surface skinning within ~4 to 8 minutes
• Unprimed Adhesion: Excellent primerless bonding to metals, glass, ceramics, and PCB laminates
• Electrical Insulation: High dielectric strength ~20 kV/mm
• Flame Rating: UL 94 V-0 recognized
• Operating Temperature: Stable performance across -45°C to +200°C

Applications

• Bonding heat-generating power semiconductors, transistors, and IC packages to heatsinks
• Thermal management in LED lighting power drivers, power supplies, and automotive ECUs
• Mechanical fixing and heat dissipation for components mounted on PCBs
• Applied via standard caulking guns or automated dispensing equipment

Key Advantages

• Standard 330 ml (860 g) cartridge format fits seamlessly into industrial dispensing lines and manual guns
• Ready-to-use single-component formula eliminates mix ratio errors and pot-life issues
• Non-corrosive neutral cure system safe for sensitive copper and circuit board tracks
• Optimizes thermal coupling while absorbing mechanical shock and thermal stress

Application Note: Mating surfaces should be thoroughly cleaned and degreased prior to application. Cure rate depends on ambient humidity and ambient temperature.