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Technical Product Data |  |
| DOWSIL™ 3-1003 Thermally Conductive Adhesive (430 g) – One-Part Flowable Heat-Cure Adhesive |
| Product Description |
| DOWSIL™ 3-1003 Thermally Conductive Adhesive is a one-part, gray, flowable silicone adhesive designed to provide efficient thermal transfer and strong structural bonding between electronic heat sources and heat sinks. Its heat-cure mechanism allows rapid curing even in deep sections. |
| Key Features |
| • Flowable Rheology: Easily flows into intricate spaces and fills air gaps • Thermal Conductivity: Thermally conductive filler system dissipates heat effectively • Cure Mechanism: One-part heat-accelerated addition cure requiring no mixing • Primerless Adhesion: Excellent unprimed bonding to metals, ceramics, and PCB laminates • Dielectric Strength: Protects electronic circuitry against electrical shorts • High Stability: Maintains elasticity and thermal performance across extreme temperature ranges |
| Applications |
| • Bonding heat-generating components (power modules, ICs) to heatsinks or cold plates • Automotive electronics, LED lighting drivers, and power supplies • Structural bonding requiring simultaneous thermal management on PCBs • Dispensing via automated equipment or manual cartridge tools |
| Key Advantages |
| • 430 g cartridge packaging offers convenient, precise application for assembly lines • Ready-to-use one-part formulation eliminates mixing errors and pot-life constraints • Reduces thermal stress on delicate microelectronics to extend overall device service life • Addition-cure chemistry produces no harmful cure by-products |
Application Note: Substrate surfaces should be thoroughly cleaned and degreased prior to application. Cure time is temperature-dependent and varies with heat exposure.
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