Whatsapp ile sohbet et
1
Müşteri Desteği
Çevrimiçi
Merhaba! 👋 Size nasıl yardımcı olabilirim?
Şimdi
Free Shipping on 10+ ItemsShips from StockOfficial Distributor in TurkeyOriginal Product GuaranteeSame-Day Shipping
Account
Forgot password?
REGISTER
Cart

DOWSIL Q3-1566 Heat Resistant Adhesive Black 20 LT - Türkiye's Official Distributor

Barcode : 1.YP.XI1.EY.KR.ST.BS.007
Request a Quote
DOWSIL Logo Technical Product Data
DOWSIL™ Q3-1566 Heat Resistant Adhesive Sealant Black (20 LT) – High Temperature Neutral RTV Silicone Adhesive
Product Description
DOWSIL™ Q3-1566 Heat Resistant Adhesive Sealant Black is a one-part, black, neutral-cure RTV silicone engineered for high-temperature bonding and sealing applications in automotive and industrial markets. It maintains its flexibility and adhesive bond strength even under extreme thermal stress.
Key Features
• Thermal Resistance: Continuous service up to 275°C, short-term peak stability up to 350°C
• Cure Mechanism: One-part, room temperature moisture-curing (RTV) neutral alkoxy system
• Consistency: Non-slump paste consistency holds bead shape on vertical joints
• Adhesion: Excellent primerless bonding to glass, metals, cast aluminum, and ceramics
• Elasticity: Flexible elastomer cushions mechanical vibration and differential thermal movement
• Format & Color: Black, 20 Liter bulk pail container
Applications
• Sealing industrial ovens, chimneys, heat exchangers, and furnace doors
• Automotive exhaust auxiliary components, engine flanges, and FIPG gasket applications
• Oven glass bonding and high-heat gasket sealing in domestic appliances
• Bulk dispensing via industrial pumps or automated robotic assembly lines
Key Advantages
• 20 Liter bulk pail packaging maximizes production efficiency for automated assembly lines
• Non-corrosive neutral cure chemistry is safe for sensitive metals and electronic components
• Resists hardening, cracking, or embrittlement at elevated temperatures
• Provides long-term durable sealing against moisture, UV, and harsh environment exposure
Application Note: Substrates should be clean, dry, and degreased with solvent prior to application for maximum adhesion strength.
Prepared by  T-Soft E-Commerce.