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DOWSIL 96-083 Silicone Adhesive High-Adhesion Silicone Adhesive - Türkiye's Official Distributor
Barcode : 1.YP.DC1.EY.KR.ST.BS.051
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Technical Product Data | ![]() |
| DOWSIL 96-083 Silicone Adhesive – Two-Part Heat-Cure High Performance Adhesive |
| Product Description |
| DOWSIL™ 96-083 Silicone Adhesive is a two-component, flexible silicone-based structural adhesive formulated to provide high bond strength and thermal endurance in demanding industrial and electronic applications. Its heat-accelerated addition cure chemistry produces no cure by-products and ensures uniform deep-section cure. |
| Key Features |
| • Cure Mechanism: Two-part heat-accelerated addition cure system • Adhesion: Excellent primerless bonding to metals, glass, ceramics, and engineering plastics • Thermal Range: Wide operating service temperature stability from -45°C to +200°C • Flexibility & High Strength: Flexible elastomeric rubber cushions mechanical shock, vibration, and thermal expansion mismatch • Deep-Section Cure: Cures completely in unexposed joints independent of atmospheric humidity • Electrical Insulation: High dielectric strength provides superior circuit insulation |
| Applications |
| • Bonding and sealing automotive electronics, sensor modules, and Electronic Control Units (ECUs) • Power electronics, inverters, and high-temperature industrial equipment assemblies • Precision optical components, glass-to-metal, and plastic-to-metal structural joints • High-volume assembly lines using automated meter-mix dispensing systems |
| Key Advantages |
| • Rapid heat cure drastically reduces cycle times in high-speed automated manufacturing • Non-corrosive addition cure chemistry generates no by-products, ensuring safety for delicate electronics • Excellent resistance to harsh environmental conditions, moisture, UV radiation, and chemicals • Maintains long-term bond strength and elasticity across demanding thermal cycles |
Application Note: Mix both components thoroughly at the specified ratio, degas under vacuum to remove trapped air, and apply heat for full cure.
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