DOWSIL

DOWSIL TC-5515 LT Thermally Conductive Gap Filler Kit 720 G

Barcode : 1.YP.DC1.EY.BL.SÇ.KT.012

Product Code : 1.YP.DC1.EY.BL.SÇ.KT.012

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Technical Product Data

DOWSIL™ TC-5515 LT Thermally Conductive Gap Filler Kit (720 g) – Two-Part Low Density Silicone Material

Product Description

DOWSIL™ TC-5515 LT Kit is a two-component, 1:1 mix ratio silicone-based thermally conductive gap filler featuring a low density of 1.95 g/cm³ and a thermal conductivity of 2.0 W/m·K. Engineered for EV battery modules and automotive electronic assemblies, it cures to a soft elastomer to dissipate heat and relieve mechanical stress.

Key Features

• Thermal Conductivity: 2.0 W/m·K
• Low Density: 1.95 g/cm³ (Supports overall assembly weight reduction)
• Mix Ratio: 1:1 (Parts A & B)
• Hardness (Cured): ~65 Shore 00 (Soft, compressible, and stress-relieving structure)
• Electrical Insulation: Dielectric Strength 19.0 kV/mm
• Rheology: Thixotropic (Non-slumping on vertical surfaces)
• Flame Rating: UL 94 V-0 recognized
• Operating Temperature Range: -40°C to +150°C

Applications

• Electric Vehicle (EV) battery modules and cell-to-chassis thermal interfaces
• Power control units (ECU), inverters, and automotive power electronics
• Thermal gap filling between PCB-mounted components and aluminum heatsinks
• Applied via manual dispensing guns or automated dispensing lines

Key Advantages

• 720 g kit (360 g Part A + 360 g Part B dual cartridge) format ideal for assembly, service, and production
• Low specific gravity reduces total component weight in automotive applications
• Room-temperature cure or accelerated heat cure (30 mins @ 80°C)
• Tacky surface after cure facilitates easy rework and disassembly if servicing is needed

Application Note: For optimal performance, mix Parts A and B at a 1:1 ratio using a static mixer nozzle. Ensure substrate surfaces are thoroughly cleaned and dry prior to dispensing.