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MG Chemicals 834HTC – High Thermal Conductivity Epoxy Encapsulating & Potting Compound | TeknikExpo

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Technical Product Information
MG Chemicals 834HTC – High Thermal Conductivity Epoxy Potting Compound
Product Description
MG Chemicals 834HTC is a specialized two-part epoxy encapsulating and potting compound engineered for high thermal conductivity. It is designed to dissipate heat from sensitive electronic components, such as power electronics and LED modules, while providing robust mechanical protection and high dielectric strength. Its durable formula safeguards electronics from moisture, chemicals, and physical stress.
Technical Features & Performance
• Formula: High thermal-fill epoxy system
• Heat Management: Efficient heat transfer from hot spots to heat sinks
• Electrical Properties: Excellent dielectric insulation to prevent short circuits
• Formats: 900 mL, 4.25 L, and 45 L industrial kits
• Resistance: Protects against water, dust, thermal shock, and chemicals
Applications
• Potting of power supplies, motor controllers, and inverters
• Thermal management for high-brightness LED lighting systems
• Encapsulation of industrial sensors and control boards
• Defense, automotive, and aerospace electronics requiring heat dissipation
Advantages
• Extends the lifespan of electronics by preventing overheating
• Maintains structural integrity during extreme thermal cycling
• Provides a high-barrier seal against environmental contaminants
• Scalable options available for both R&D labs and high-volume manufacturing
Technical Note: For optimal results, ensure thorough mixing and use vacuum degassing to remove air bubbles before pouring the compound.
Prepared by  T-Soft E-Commerce.