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DOWSIL TC-5021 Thermally Conductive Compound 1 KG
Barcode : 1.YA.MO1.GR.BL.Sİ.ZO.004
Product Code : 1.YA.MO1.GR.BL.Sİ.ZO.004
448.55 Euro + VAT
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Technical Product Data | ![]() |
| DOWSIL™ TC-5021 Thermally Conductive Compound (1 kg) – High Performance Thermal Paste |
| Product Description |
| DOWSIL™ TC-5021 Thermally Conductive Compound is a flowable, non-curing silicone thermal grease designed to provide optimal thermal conductivity (3.3 W/m·K) and exceptionally low thermal resistance between high-power electronic components and heatsinks. Its ability to achieve thin Bond Line Thickness (BLT) enables rapid heat dissipation. |
| Key Features |
| • Thermal Conductivity: 3.3 W/m·K (High thermal performance) • Thermal Resistance: ~0.2 °C·cm²/W (at 40 psi) • Viscosity: ~82,650 mPa·s / cP (Flowable and easily pumpable) • Cure Mechanism: Non-curing (No baking or heat curing required) • Dielectric Strength: 5 kV/mm (125 Volts/mil) • Specific Gravity: 3.47 g/cm³ • Color / Appearance: Smooth, gray thermal grease |
| Applications |
| • Cooling systems for Server, Desktop, and Notebook computer MPU/CPU/GPU units • Sensitive PCB assemblies and high-power integrated circuit packages • Power electronic modules, inverters, and E-Mobility driver units • High-volume automated lines using screen printing, stencil printing, or dispensing equipment |
| Key Advantages |
| • 1 kg bulk packaging offers a cost-effective solution for automated industrial manufacturing • Maintains consistency at elevated temperatures with extremely low oil bleed (0.15%) and drying • Non-curing properties allow easy disassembly and servicing without component damage • Minimizes thermal resistance between heat source and cooling plate for maximum device longevity |
Application Note: Surfaces should be thoroughly cleaned with solvent (isopropyl alcohol) to remove oil and dust prior to application. Apply using a spatula, screen printer, or automated dispensing equipment.
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