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DOWSIL TC-5021 Thermally Conductive Compound 1 KG

Barcode : 1.YA.MO1.GR.BL.Sİ.ZO.004
Product Code : 1.YA.MO1.GR.BL.Sİ.ZO.004
448.55 Euro + VAT
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448.55 Euro + VAT
DOWSIL Logo Technical Product Data
DOWSIL™ TC-5021 Thermally Conductive Compound (1 kg) – High Performance Thermal Paste
Product Description
DOWSIL™ TC-5021 Thermally Conductive Compound is a flowable, non-curing silicone thermal grease designed to provide optimal thermal conductivity (3.3 W/m·K) and exceptionally low thermal resistance between high-power electronic components and heatsinks. Its ability to achieve thin Bond Line Thickness (BLT) enables rapid heat dissipation.
Key Features
• Thermal Conductivity: 3.3 W/m·K (High thermal performance)
• Thermal Resistance: ~0.2 °C·cm²/W (at 40 psi)
• Viscosity: ~82,650 mPa·s / cP (Flowable and easily pumpable)
• Cure Mechanism: Non-curing (No baking or heat curing required)
• Dielectric Strength: 5 kV/mm (125 Volts/mil)
• Specific Gravity: 3.47 g/cm³
• Color / Appearance: Smooth, gray thermal grease
Applications
• Cooling systems for Server, Desktop, and Notebook computer MPU/CPU/GPU units
• Sensitive PCB assemblies and high-power integrated circuit packages
• Power electronic modules, inverters, and E-Mobility driver units
• High-volume automated lines using screen printing, stencil printing, or dispensing equipment
Key Advantages
• 1 kg bulk packaging offers a cost-effective solution for automated industrial manufacturing
• Maintains consistency at elevated temperatures with extremely low oil bleed (0.15%) and drying
• Non-curing properties allow easy disassembly and servicing without component damage
• Minimizes thermal resistance between heat source and cooling plate for maximum device longevity
Application Note: Surfaces should be thoroughly cleaned with solvent (isopropyl alcohol) to remove oil and dust prior to application. Apply using a spatula, screen printer, or automated dispensing equipment.
Prepared by  T-Soft E-Commerce.