DOWSIL TC-5021 is a silicone-based, thermally conductive compound with ~2.0 W/m·K conductivity. It ensures efficient heat transfer between electronic components and heat sinks, provides electrical insulation, and remains stable without curing. Ideal for LEDs, power modules, inverters, automotive electronics, and industrial thermal management.
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Technical Product Information |  |
| DOWSIL™ TC-5021 Thermally Conductive Compound (1 kg) – High-Performance Thermal Interface Material |
| Product Description |
| DOWSIL™ TC-5021 is a high-performance, silicone-based thermally conductive compound designed to facilitate heat transfer between electronic components and heat sinks. It effectively dissipates heat to prevent overheating and maintain consistent device performance. |
| Key Features |
| • Thermal Conductivity: ~2.0 W/m·K • Type: Silicone-based, single-component, non-curing compound • Insulation: Provides high electrical insulation for circuit safety • Stability: Resistant to flow and maintains properties over a wide temperature range • Application: Pumpable consistency ideal for automated dispensing |
| Areas of Use |
| • CPU/GPU processors and power electronics • LED lighting modules and automotive control units (ECUs) • Inverter systems and power supply modules • Industrial equipment thermal management |
| Advantages |
| • 1 kg bulk packaging suitable for industrial production lines • Enhances device reliability by reducing thermal stress • No curing required for immediate thermal coupling • Long-term stability under harsh operating conditions |
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