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DOWSIL™ 93-500 Space Grade Encapsulant Kit Clear 0.49 KG | Official Distributor

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Technical Product Information

DOWSIL™ 93-500 Space Grade Encapsulant Kit Clear 0.49 KG

Product Overview

DOWSIL™ 93-500 Space Grade Encapsulant Kit Clear is a 2-part (10:1 mix ratio), high-purity, addition-cure transparent silicone potting and encapsulating compound specially formulated for satellite, spaceflight, and critical aerospace applications. Utilizing a platinum-catalyzed addition-cure system, it cures at room temperature or with mild heat without producing cure byproducts or volumetric shrinkage. Its high optical transparency and shock-absorbing flexibility safeguard delicate components against high vacuum outgassing, radiation, and severe thermal shock. The 0.49 kg kit provides an ideal quantity for precision aerospace assemblies and laboratory operations.

Key Features and Benefits

• Space-Grade Low Outgassing: Tested and compliant with NASA SP-R-0022A and ESA PSS-01-702 outgassing criteria (TML < 1.0%, CVCM < 0.10%).
• High Optical Clarity: Excellent light transmission for solar cells, optical sensors, and glass bonding.
• Non-Corrosive Addition Cure: Zero cure byproducts, making it completely non-corrosive to sensitive electronic circuits and metallization.
• Extreme Temperature Performance: Retains elasticity and dielectric properties across a broad range from -55°C to +200°C (-67°F to +392°F).
• Vibration and Shock Absorption: Protects fragile electronics against launch stresses, mechanical vibration, and thermal shocks.
• Convenient 0.49 KG Kit: Ideal for precision aerospace applications and medium-scale potting tasks.

Technical Specifications

• Color: Clear / Transparent
• Packaging / Net Weight: Kit / 0.49 KG (490 Grams)
• Mix Ratio (by weight): 10:1 (Part A : Part B)
• Cure System: Addition-cure (Platinum catalyst)
• Viscosity (Mixed): Low viscosity (pourable and self-leveling)
• Hardness (Shore A): ~40-50
• Service Temperature Range: -55°C to +200°C (-67°F to +392°F)

Applications

• Encapsulation and protection of satellite solar cells, photodetectors, and optical sensor arrays.
• Potting of critical electronic circuit modules on spacecraft, launch vehicles, and missile systems.
• Bonding and sealing defense optical lenses, detector assemblies, and laser equipment.
• Cleanroom assemblies requiring rigorous low outgassing under deep vacuum conditions.

Usage Note: Thoroughly mix Part A and Part B in a 10:1 ratio by weight. Vacuum degassing prior to potting is mandatory to remove entrapped air bubbles. Avoid contact with sulfur, amines, or organometallic compounds to prevent platinum catalyst inhibition. Ensure all mixing containers are pristine.