DOWSIL TC-5021 is a silicone-based, thermally conductive compound with ~2.0 W/m·K conductivity. It ensures efficient heat transfer between electronic components and heat sinks, provides electrical insulation, and remains stable without curing. Ideal for LEDs, power modules, inverters, automotive electronics, and industrial thermal management.
DOWSIL™ TC-5021 Thermally Conductive Compound is a silicone-based, high-performance thermal interface material that ensures excellent heat transfer between electronic components and heat sink surfaces.
This product is specially designed for components such as processors, power modules, LED lighting, inverters, and automotive electronics, where it effectively dissipates heat to prevent overheating. With a high thermal conductivity of approximately 2.0 W/m·K, DOWSIL TC-5021 helps extend device lifespan and prevents performance degradation.
Supplied in a 1 kg package, it is ideal for use in production lines, maintenance operations, and custom applications. Despite its high viscosity, it can be pumped and applied easily, and remains stable for long periods without curing.
Being electrically insulating, it provides both thermal and electrical safety.
Thermal conductivity: ~2.0 W/m·K
Silicone-based, single-component material
Non-curing – no hardening required
Provides electrical insulation
High viscosity – non-flowing formulation
Stability across a wide temperature range
Long-term durability and performance
Practical 1 kg packaging
Cooling of electronic circuits and PCBs
Thermal transfer in LED modules
Automotive control units
Power electronics and inverter systems
Contact surfaces with heat sinks and metal substrates
Thermal management in industrial equipment
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