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MG Chemicals 8331D – Silver Conductive Epoxy Adhesive | TeknikExpo

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Technical Product Information
MG Chemicals 8331D – Silver Conductive Epoxy Adhesive
Product Description
MG Chemicals 8331D is a silver-filled, two-part conductive epoxy designed for forming electrical connections and mechanically securing components in electronic circuits. It provides low volume resistivity and delivers long-term, reliable conductivity upon curing. Ideal as a "cold solder" alternative for heat-sensitive electronics where traditional soldering is impractical.
Technical Features & Performance
• Formula: High-purity silver-filled epoxy system
• Conductivity: Excellent electrical conductivity with low contact resistance
• Formats: Available in 14 g (precision) and 120 g (industrial) kits
• Adhesion: Strong mechanical bond to various electronic substrates
• Reliability: Stable performance under various environmental conditions
Applications
• Rework and repair of PCB traces and pads
• Mounting of sensors, LEDs, and micro-electronics
• Bonding to non-solderable surfaces like glass or specialized plastics
• Antenna connections and static dissipation/grounding
Advantages
• Combines high electrical conductivity with structural bonding in one step
• Eliminates thermal stress associated with conventional soldering
• Suitable for both high-precision laboratory work and large-scale maintenance
• Non-migrating and non-corrosive silver filler for long-term stability
Technical Note: For maximum conductivity, ensure surfaces are clean and dry. Mix parts A and B in a 1:1 ratio until the color is uniform. Curing can be accelerated with mild heat.
Prepared by  T-Soft E-Commerce.