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 | Technical Product Information |  |
| DOWSIL™ 340 Heat Sink Compound – Thermal Paste and Heat Transfer Compound |
| Product Description |
| DOWSIL™ 340 is a non-curing, silicone-based thermal conductivity compound developed to optimize heat transfer in electronic devices. By filling the microscopic gaps between heat sources and heat sinks, it effectively dissipates heat and helps keep components at safe operating temperatures. |
| Key Features |
| • Heat Transfer: Superior thermal conductivity and rapid heat dissipation • Insulation: Electrically insulating, does not create short-circuit risk • Stability: Maintains its physical properties in the range of -40°C to +200°C • Structure: Does not require curing; has low evaporation and flow characteristics • Compatibility: Safe use with metal, ceramic, and plastic surfaces |
| Application Areas |
| • Cooling of transistors, diodes, and integrated circuits (ICs) • Surface contact between heat sources and heat sink blocks • LED lighting modules and power electronics • All sensitive electronic systems that are temperature-sensitive |
| Advantages |
| • Extends component lifespan and improves operating performance • Thanks to its non-curing structure, it allows easy maintenance and replacement even years later • Does not dry out, harden, or flow at high temperatures • Provides a permanent and reliable heat transfer solution |
