DOWSIL 340 is a silicone-based, electrically insulating, non-curing thermal compound designed to improve heat transfer between heat sources and heat sinks. With stability from -40°C to +200°C, low evaporation, and long-term performance, it is ideal for CPUs, GPUs, LEDs, power modules, and electronics.
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Technical Product Information |  |
| DOWSIL™ 340 Heat Sink Compound – Thermal Conductive Grease |
| Product Description |
| DOWSIL™ 340 is a silicone-based, non-curing thermal compound designed to optimize heat transfer in electronic devices. By filling the microscopic air gaps between heat sources and heat sinks, it ensures efficient cooling and maintains safe operating temperatures for sensitive components. |
| Key Features |
| • Thermal Performance: High thermal conductivity for effective heat dissipation • Insulation: Electrically insulating, prevents short circuits • Stability: Operates reliably from -40°C to +200°C • Non-Curing: Maintains its grease-like consistency indefinitely • Reliability: Low bleed and high temperature stability |
| Applications |
| • Cooling of transistors, diodes, and Integrated Circuits (IC) • Interface between heat sources and cooling blocks/heat sinks • LED modules and power supply assemblies • Any electronic system requiring thermal management |
| Advantages |
| • Extends component life by preventing overheating • Does not dry out, harden, or melt even after long-term use • Allows for easy disassembly and maintenance since it never cures • Provides a permanent thermal bridge for consistent performance |
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